Rigid-Flex PCB For Joint Module(Shoulder/Hip/Knee)

· Rigid substrate + flexible polyimide layers · 3D interconnection · Foldable & lightweight · For wearable devices / medical implants / automotive electronics / aerospace systems

Product Information

• Supplier Qualification: ISO 9001:2015 & IPC-6013 certified · Specialized coverlay & stiffener lamination lines · 100% impedance & bend-cycle test per panel
• Technical Specification: Layer count 4–20 layers · Bend radius ≥6× thickness · Trace width/spacing 50/50 μm · Impedance control ±10% · Operating −40 to +125 ℃
• Available Documents: CE RoHS DoC / REACH SVHC Statement / Halogen-Free Certificate (IEC 61249-2-21) / IPC-6013 compliance report / Bend-Cycle Test Report / Impedance TDR test report / Cross-sectional analysis report / UL certification / Material Cert (EN 10204 3.1) (+KC / EAC per destination)